Photoetching Glass

Photoetching glass is a new glass material with high mechanical strength and good dielectric properties. It supports photolithography and wet etching to form micro 3D structures, widely used in chip substrates, microfluidics, optical waveguides and micro components.

Description
Main Parameter

Minimum thickness of glass	0.1mm
Dielectric loss	6.5×10⁻³
Thermal expansion coefficient (20 °C~300 °C)	8.9×10⁻⁶
Glass transition temperature	460 °C
Minimum through-hole diameter	10μm (@ 0.1mm)

Photoetching glass is a new type of glass material that is compatible with advanced micro/nano processing technology. It has good mechanical strength and dielectric properties. In addition, it also has the characteristics of photochemical processing. Based on the photochemical processing characteristics, photolithography technology and wet etching process can be used to process fine micrometer level three-dimensional structures on the surface or inside of the glass. This type of glass can be applied to chip substrates, passive inductors, microfluidics, optical waveguides, micro pumps, turbines, micro satellite power pulse components, etc.

Minimum thickness of glass: 0.lmm
Dielectric loss: 6.5 x 10-3
Thermal expansion coefficient (20 °C~300 °C): 8.9 x 10-6
Glass transition temperature: 460 °C
Minimum through-hole diameter: 10μm (@ 0.1mm)

Photoetching Glass

Description

Main Parameter

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